R Dataset / Package rpart / solder
Soldering of Components on Printed-Circuit Boards
solder data frame has 720 rows and 6 columns, representing
a balanced subset of a designed experiment varying 5 factors on the
soldering of components on printed-circuit boards.
This data frame contains the following columns:
a factor with levels L, M and S indicating the amount of clearance around the mounting pad.
a factor with levels Thick and Thin giving the thickness of the solder used.
a factor with levels A1.5, A3, B3 and B6 indicating the type and thickness of mask used.
a factor with levels D4, D6, D7, L4, L6, L7, L8, L9, W4 and W9 giving the size and geometry of the mounting pad.
1:3indicating the panel on a board being tested.
a numeric vector giving the number of visible solder skips.
John M. Chambers and Trevor J. Hastie eds. (1992) Statistical Models in S, Wadsworth and Brooks/Cole, Pacific Grove, CA.
fit <- rpart(skips ~ Opening + Solder + Mask + PadType + Panel, data = solder, method = "anova") summary(residuals(fit)) plot(predict(fit), residuals(fit))
Dataset imported from https://www.r-project.org.
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